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  december 2010 doc id 18295 rev 1 1/7 7 STPS30H60C-Y automotive power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching aec-q101 qualified description 30 a dual center tab schottky rectifier suitable for automotive applications. package in powerso-20 (slug up), this device is especially intented for use in a low voltage applications. table 1. device summary symbol value i f(av) 2 x 15 a v rrm 60 v t j(max) 150 c v f(max) 0.645 v a1 a2 k k a2 a1 k pin 1 pin 10 pin 11 pin 20 k k powerso-20 (slug up) stps30h60cky-tr www.st.com
characteristics STPS30H60C-Y 2/7 doc id 18295 rev 1 1 characteristics when diodes 1 and 2 are used simultaneously: t j(diode 1) = p (diode1) x r th(j-c)(per diode) + p (diode 2) x r th(c) table 2. absolute rating (limiting value, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v if (rms) (1) 1. all anode pins (a1, a2) must be connected forward rms current 45 a if (av) (1) average forward current t c = 140 c, = 0.5 square pulse per diode 15 a t c = 135 c, = 0.5 square pulse per device 30 i fsm (1) surge non repetitive forward current t p = 10 ms sinusoidal 250 a t stg storage temperature range -65 to +175 c t j operating junction temperature range -40 to +150 c t r recommended reflow soldering temperature range 245 +0/-5 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case per diode per device 0.95 0.61 c/w r th(c) coupling 0.27 c/w table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test : tp = 380 s, d < 2% reverse leakage current t j = 25 c v r = v rrm 150 a t j = 125 c 45 ma v f (1) (2) 2. all anode pins (a1, a2) must be connected to evaluate the maximum conduction losses use the following equation: p = 0.385 x i f(av) + 0.00867 x i f 2 (rms) forward voltage drop t j = 25 c i f = 15 a 0.580 v t j = 125 c i f = 15 a 0.515 t j = 25 c i f = 30 a 0.700 t j = 125 c i f = 30 a 0.645
STPS30H60C-Y characteristics doc id 18295 rev 1 3/7 figure 1. average forward power dissipation versus average forward current (per diode, all anode pins connected) figure 2. average forward current versus ambient temperature (per diode, all anode pins connected) ( = 0.5) 0 2 4 6 8 10 12 0 2 4 6 8 101214161820 p (w) f(av) t = t / t p t p i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 2 4 6 8 10 12 14 16 18 0 25 50 75 100 125 150 i (a) f(av) r th(j-a) = r th(j-c) r th(j-a) = 10 c/w t (c) amb t = t / t p t p figure 3. non repetitive surge peak forward current versus overload duration (maximum values) figure 4. relative variation of thermal impedance junction to case versus pulse duration 0 50 100 150 200 250 300 1.e-03 1.e-02 1.e-01 1.e+00 i m t = 0.5 t(s) t = 25 c c t = 75 c c t = 125 c c i (a) m (per diode, all anode pins connected) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-c) th(j-c) t (s) p single pulse (per diode, all anode pins connected) figure 5. reverse leakage current versus reverse voltage applied (per diode) (typical values) figure 6. junction capacitance versus reverse voltage applied (per diode) (typical values) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 50 55 60 v (v) r i (ma) r t = 25 c j t = 50 c j t = 75 c j t = 125 c j t = 150 c j t = 100 c j 0.1 1.0 10.0 1 10 100 v (v) r c(nf) f=1mhz v=30mv t=25c osc rms j
characteristics STPS30H60C-Y 4/7 doc id 18295 rev 1 figure 7. forward voltage drop versus forward current (per diode, all anode pins connected, low level) figure 8. forward voltage drop versus forward current (per diode, all anode pins connected, high level) 0 5 10 15 20 25 30 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 i (a) fm v (v) fm (typical values) t = 125 c j (maximum values) t = 125 c j (maximum values) t = 25 c j 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 i (a) fm v (v) fm (typical values) t = 125 c j (maximum values) t = 125 c j (maximum values) t = 25 c j
STPS30H60C-Y package information doc id 18295 rev 1 5/7 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. powerso-20 (slug up) dimensions ref dimensions millimeter inch min typ max min typ max a 3.25 3.5 0.128 0.138 a2 3 3.15 3.3 0.118 0.124 0.13 a4 0.8 1 0.031 0.039 a5 0.15 0.2 0.25 0.006 0.008 0.01 a1 0.03 -0.04 0.0012 -0.0016 b 0.4 0.53 0.016 0.021 c 0.23 0.32 0.009 0.012 d (1) 1. these measurements do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15 mm (0.006?). critic al dimensions: e, a1, e, and g. 15.8 16 0.622 0.63 d1 9.4 9.8 0.37 0.385 d2 1 0.039 e 13.9 14.5 0.547 0.57 e1 (1) 10.9 11.1 0.429 0.437 e2 2.9 0.114 e3 5.8 6.2 0.228 0.244 e 1.12 1.27 1.42 0.044 0.05 0.056 e3 11.43 0.45 g 0 0.1 0 0.004 h 15.5 15.9 0.61 0.625 h 1.1 0.043 l 0.8 1.1 0.031 0.043 n1010 r 0.6 0.024 s0 80 8 v5 75 7 e a a2 e a1 a5 d2 (x2) m pso20dme d e1 e2 e2 hx45 s gage plane 0.35 l detail a detail a (co planar ity) gc -c- seating plane e3 b c n h n v e3 10 1 d1 20 11 a4 r
ordering information STPS30H60C-Y 6/7 doc id 18295 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps30h60cky-tr ps30h60cy powerso-20 1.93 g 600 tape and reel table 7. document revision history date revision changes 02-dic-2010 1 first issue.
STPS30H60C-Y doc id 18295 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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